US 12,295,130 B2
Module including a grooved shield film
Tetsuya Oda, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Jan. 4, 2023, as Appl. No. 18/149,819.
Application 18/149,819 is a continuation of application No. PCT/JP2021/024981, filed on Jul. 1, 2021.
Claims priority of application No. 2020-119241 (JP), filed on Jul. 10, 2020.
Prior Publication US 2023/0144540 A1, May 11, 2023
Int. Cl. H05K 9/00 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01)
CPC H05K 9/0022 (2013.01) [H05K 3/284 (2013.01); H05K 1/181 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1322 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate including a first surface;
a first component mounted on the first surface, wherein at least a part of a surface of the first component on a side distant from the substrate in a direction perpendicular to the first surface is covered with a first conductive film;
a sealing resin arranged to cover the first surface and the first component; and
a shield film covering at least a part of a surface of the sealing resin on the side distant from the substrate in the direction perpendicular to the first surface, wherein
the shield film includes a first shield portion superimposed on at least a part of the first conductive film when viewed in the direction perpendicular to the first surface and a second shield portion different from the first shield portion, the first shield portion is isolated from the second shield portion by a groove dividing the shield film and provided to such a depth as entering the sealing resin, and the first shield portion is electrically independent.