US 12,295,129 B2
Module having a shield film and method of manufacturing the same
Tetsuya Oda, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Jan. 11, 2023, as Appl. No. 18/153,051.
Application 18/153,051 is a continuation of application No. PCT/JP2021/024982, filed on Jul. 1, 2021.
Claims priority of application No. 2020-122853 (JP), filed on Jul. 17, 2020.
Prior Publication US 2023/0141689 A1, May 11, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 9/00 (2006.01); H05K 3/30 (2006.01)
CPC H05K 9/00 (2013.01) [H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/10371 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate including a first surface;
a first component mounted on the first surface, at least a part of a surface of the first component on a side distant from the substrate in a direction perpendicular to the first surface is covered with a first conductive film;
a sealing resin arranged to cover the first surface and the first component; and
a shield film that covers a part of a surface of the sealing resin on the side distant from the substrate in the direction perpendicular to the first surface, wherein
the surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in the direction perpendicular to the first surface and a non-shielded region not covered with the shield film, and
the non-shielded region is superimposed on at least a part of the first conductive film when viewed in the direction perpendicular to the first surface.
 
11. A method of manufacturing a module comprising:
preparing a substrate assembly including a first surface;
mounting a first component on the first surface;
forming a sealing resin to cover the first surface and the first component;
bonding a sheet to cover a surface of the sealing resin on a side distant from the first surface;
providing a groove in the sealing resin from above the sheet such that the groove surrounds the first component when viewed in a direction perpendicular to the first surface;
removing the sheet in a region other than a region surrounded by the groove;
dividing the substrate assembly and the sealing resin into a size of an individual module;
forming a shield film to cover an upper surface and a side surface of the sealing resin of the size of the individual module; and
removing the sheet from the region surrounded by the groove after the forming the shield film.