| CPC H05K 7/209 (2013.01) [H01L 23/3735 (2013.01); H01L 25/071 (2013.01)] | 20 Claims |
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1. A method, comprising:
arranging first and second support elements, each having first and second faces and formed by an electrically insulating and thermally conductive multilayer;
bonding a first electronic component to the second face of the second support element, bonding a second electronic component to the second face of the first support element, bonding a third electronic component to the second face of the second support element, and bonding a fourth electronic component to the second face of the first support element, and the first electronic component is a first power transistor, the second electronic component is a second power transistor, the third electronic component is a third power transistor, and the fourth electronic component is a fourth power transistor;
bonding a first lead on the second face of the second support element and a second lead on the second face of the second support element;
forming a thermal distribution structure that includes first, second, and third contacting elements and an intermediate mass, the first, second, and third contacting elements each include an electrically insulating and thermally conductive multilayer, the first contacting element being arranged on a first side of the intermediate mass, the second contacting element being arranged on a second side of the intermediate mass, and the third contacting element being arranged on the second side of the intermediate mass and adjacent to and electrically insulated with respect to the second contacting element;
bonding the first contacting element of the thermal distribution structure to the second electronic component, bonding the second contacting element of the thermal distribution structure to the first electronic component, and bonding the third contacting element to the third power transistor and the fourth power transistor; and
forming a packaging mass surrounding the thermal distribution structure and the first and the second support elements, the first face of the first support element forming a first thermal dissipation surface of a device and the first face of the second support element forming a second thermal dissipation surface of the device, and
wherein bonding the third power transistor to the second surface of the second support element and bonding the fourth power transistor to the second surface of the first support element occurs before bonding the first and second contacting elements to the first and second electronic components.
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