US 12,295,125 B1
Efficient thermal control system for microcircuit based on liquid metal coolant
Haowei Li, Zhanjiang (CN); Qing Xu, Zhanjiang (CN); Weijun Feng, Zhanjiang (CN); Jianyao Chen, Zhanjiang (CN); Yuanxing Mao, Zhanjiang (CN); Caisheng Li, Zhanjiang (CN); and Jiakun Liu, Zhanjiang (CN)
Assigned to Guangdong Ocean University, Zhanjiang (CN)
Filed by Guangdong Ocean University, Zhanjiang (CN)
Filed on Jan. 15, 2025, as Appl. No. 19/022,096.
Application 19/022,096 is a continuation of application No. PCT/CN2024/136302, filed on Dec. 3, 2024.
Claims priority of application No. 202410044864.7 (CN), filed on Jan. 12, 2024.
Int. Cl. H05K 7/20 (2006.01); F28F 27/02 (2006.01)
CPC H05K 7/20772 (2013.01) [F28F 27/02 (2013.01); H05K 7/20836 (2013.01); H05K 7/20327 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An efficient thermal control system for a microcircuit based on liquid metal coolant, comprising: a cooling water system, a liquid metal supply system and a cooling system;
wherein the liquid metal supply system is used for supplying liquid metal to the cooling system, so as to achieve heat exchange with a chip through the liquid metal, and the cooling water system is used for cooling the liquid metal;
wherein the cooling system comprises:
a cooling capacity distribution unit, wherein the cooling capacity distribution unit is used for distributing the liquid metal;
a plurality of cabinets, wherein each of the cabinets is provided with chip cooling platforms, the cooling capacity distribution unit is in communication with the chip cooling platforms through a pipe, and each of the chip cooling platforms is provided with the chip;
a temperature measuring component, wherein the temperature measuring component is used for measuring temperature of the chip; and
a control unit, wherein both the cooling capacity distribution unit and the temperature measuring component are electrically connected to the control unit;
wherein each of the chip cooling platforms comprises:
a housing, wherein the chip is installed on the housing, one end of a bottom surface of the housing is provided with an inlet in communication with the cooling capacity distribution unit, and another end of the bottom surface of the housing is provided with an outlet; and
a micro-fin array, wherein the micro-fin array is fixedly arranged inside the housing, and an inlet end of the outlet is higher than the micro-fin array;
wherein each of branch pipes at inlets and outlets of the chip cooling platforms is provided with a flow regulating valve; and
wherein when the chip ≥90° C., the control unit sets opening degrees of two flow regulating valves in front of and behind the chip at different angles, so as to cool down the chip; when the chip <40° C., the control unit first closes the flow regulating valve at a front end, and closes the flow regulating valve at a back end after the liquid metal flows out.