US 12,295,120 B2
Heat transfer device providing heat transfer from components on transversely oriented circuit boards
William G. Mahoney, Suwanee, GA (US)
Assigned to Applied Optoelectronics, Inc., Sugar Land, TX (US)
Filed by Applied Optoelectronics, Inc., Sugar Land, TX (US)
Filed on Aug. 16, 2022, as Appl. No. 17/888,892.
Prior Publication US 2024/0064939 A1, Feb. 22, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/14 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/2039 (2013.01) [H05K 1/14 (2013.01); H05K 5/0026 (2013.01)] 21 Claims
OG exemplary drawing
 
18. An optical node for use in a hybrid fiber-coaxial (HFC) network, the optical node comprising:
a housing; and
a broadband digital access (BDA) module disposed in the housing, the BDA module being configured to provide optical and electrical communications between a headend/hub and subscriber locations in the HFC network, the BDA module including:
a heat transfer device including a base portion extending in a first plane and a transverse portion extending in a second plane transverse to the first plane, wherein the base portion includes at least a one base pedestal and wherein the transverse portion includes at least one transverse pedestal, and wherein the base portion is thermally coupled to the housing such that heat is transferred from the base portion to the housing;
a main circuit board mounted to the base portion, the main circuit board including at least one heat generating component in thermal contact with the at least one base pedestal such that heat is transferred from the at least one heat generating component on the main circuit board to the housing via the base portion of the heat transfer device;
a daughter circuit board mounted to the transverse portion, the daughter circuit board including at least one heat generating component in thermal contact with the at least one transverse pedestal such that heat is transferred from the at least one heat generating component on the daughter circuit board to the housing via the transverse portion and the base portion of the heat transfer device; and
wherein the transverse portion includes a passageway, and wherein the main circuit board and the daughter circuit board are connected through the passageway.