US 12,295,107 B2
Method for manufacturing an electronic device
Yu-Chia Huang, Miao-Li County (TW); Kuan-Feng Lee, Miao-Li County (TW); and Tsung-Han Tsai, Miao-Li County (TW)
Assigned to InnoLux Corporation, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Apr. 2, 2024, as Appl. No. 18/624,158.
Application 18/624,158 is a continuation of application No. 17/407,159, filed on Aug. 19, 2021, granted, now 11,974,403.
Claims priority of application No. 202010974103.3 (CN), filed on Sep. 16, 2020.
Prior Publication US 2024/0251509 A1, Jul. 25, 2024
Int. Cl. H05K 3/22 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01)
CPC H05K 3/22 (2013.01) [H05K 1/0274 (2013.01); H05K 1/028 (2013.01); H05K 3/10 (2013.01); H05K 2203/1105 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic device comprising a first region and a transparent region, the method comprising:
providing a flexible substrate;
forming an electric circuit layer on the flexible substrate at an elevated temperature;
after forming the electric circuit layer, forming an opening in the transparent region, and the opening penetrating through a portion of the electric circuit layer, and
after forming the opening, forming a filling layer on the flexible substrate, wherein at least a part of the filling layer is formed in the opening to enhance a transmittance of the transparent region.