US 12,295,100 B2
Printed circuit board including bonding layer, having conductive particles, disposed between core portions
Sang Yoon Lee, Suwon-si (KR); and Seung Eun Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 7, 2023, as Appl. No. 18/118,217.
Claims priority of application No. 10-2022-0139297 (KR), filed on Oct. 26, 2022.
Prior Publication US 2024/0147622 A1, May 2, 2024
Int. Cl. H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/14 (2013.01) [H05K 1/0298 (2013.01); H05K 1/144 (2013.01); H05K 1/185 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10984 (2013.01); H05K 2201/2081 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first core portion in which a first passive component is embedded;
a second core portion in which a second passive component is embedded; and
a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.