US 12,295,097 B1
Compact ceramic package with rear cavities
Shashank Sharma, Mountain View, CA (US)
Assigned to Waymo LLC, Mountain View, CA (US)
Filed by Waymo LLC, Mountain View, CA (US)
Filed on Dec. 14, 2021, as Appl. No. 17/550,597.
Claims priority of provisional application 63/131,168, filed on Dec. 28, 2020.
Int. Cl. H05K 1/03 (2006.01); G01S 7/4914 (2020.01); H01L 27/146 (2006.01); H10F 39/00 (2025.01)
CPC H05K 1/0306 (2013.01) [G01S 7/4914 (2013.01); H10F 39/811 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A sensor assembly comprising:
a sensor element;
a ceramic printed circuit board having a first side and a second side, wherein the first side is opposite the second side, wherein the sensor element is disposed on the first side of the ceramic printed circuit board, wherein the second side of the ceramic printed circuit board includes two or more recesses and a stiffening cross-brace portion that separates and at least partially defines two of the two or more recesses, and wherein the ceramic printed circuit board comprises a first contact pad that is disposed on the first side and that is electrically coupled to the sensor element; and
one or more electronic components, wherein the one or more electronic components are disposed on the second side of the ceramic printed circuit board within at least one of the two or more recesses, and wherein at least one electronic component of the one or more electronic components is electrically coupled to the first contact pad.