US 12,295,096 B2
Circuit board and image forming apparatus
Takeshi Honda, Chiba (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Aug. 23, 2023, as Appl. No. 18/454,264.
Claims priority of application No. 2022-135596 (JP), filed on Aug. 29, 2022.
Prior Publication US 2024/0080971 A1, Mar. 7, 2024
Int. Cl. H02K 1/02 (2006.01); G03G 15/00 (2006.01); H02K 11/33 (2016.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H02M 3/00 (2006.01)
CPC H05K 1/0292 (2013.01) [G03G 15/65 (2013.01); G03G 15/80 (2013.01); H02K 11/33 (2016.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H02K 2211/03 (2013.01); H02M 3/003 (2021.05); H05K 2201/10689 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A circuit board for an image forming apparatuses to which a first integrated circuit or a second integrated circuit is provided, comprising:
an electric part provided to a first surface of the circuit board;
a first attachment part provided to the first surface, to which at least one terminal of the first integrated circuit is attachable;
a first conductor pattern formed on the first surface and configured to constitute at least a portion of a first wiring which connects the first attachment part and the electric part;
a second attachment part provided to a second surface opposite to the first surface of the circuit board, to which at least one terminal of the second integrated circuit is attachable;
a second conductor pattern formed on the second surface and configured to constitute at least a first portion of a second wiring which connects the second attachment part and the electric part; and
a connecting via penetrating through the circuit board, extending from the first conductor pattern to the second conductor pattern, and configured to constitute a second portion of the second wiring.