US 12,295,095 B2
Printed circuit board and storage device including the same
Sunhong Park, Sejong-si (KR); and Hyunjong Oh, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 2, 2022, as Appl. No. 17/734,462.
Claims priority of application No. 10-2021-0091681 (KR), filed on Jul. 13, 2021.
Prior Publication US 2023/0014935 A1, Jan. 19, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0268 (2013.01) [H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/0269 (2013.01); H05K 3/4638 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/096 (2013.01); H05K 2201/10159 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A printed circuit board in which K (K is an integer of 2 or greater) copper clad laminates (CCLs) are laminated vertically from an uppermost circuit layer (a first layer) to a lowermost circuit layer (a K-th layer), the printed circuit board comprising:
a non-destructive testing area;
mislamination identifying portions in the non-destructive testing area, the mislamination identifying portions being in the CCLs, respectively;
through-via holes vertically exposing the mislamination identifying portions, respectively, in the non-destructive testing area, the through-via holes being spaced apart from each other by a first interval; and
a probe via extending vertically and being in contact with an end portion of each of the mislamination identifying portions on a same side,
wherein a length of the mislamination identifying portion in an N-th (N is an integer of 1 to K) layer CCL in a horizontal direction is longer than a length of the mislamination identifying portion in an (N−1)-th layer CCL in the horizontal direction, and
(N−1) copper foil removed areas are arranged at the first interval in the mislamination identifying portion positioned in the N-th layer CCL.