| CPC H05K 1/0245 (2013.01) [H05K 1/0216 (2013.01); H05K 1/111 (2013.01); H05K 1/0222 (2013.01); H05K 1/11 (2013.01)] | 16 Claims |
|
1. A printed circuit board having a major plane, the printed circuit board comprising:
a first plurality of signal pads, each signal pad in the first plurality of signal pads being on a surface of the printed circuit board that is parallel to the major plane, the first plurality of signal pads being grouped into a second plurality of differential signal pad pairs, wherein each respective differential signal pad pair defines a midpoint that is located halfway between centers of the signal pads of the respective differential signal pad pair;
a first differential signal pad pair positioned on a first line, wherein a line drawn between the centers of the signal pads of the first differential signal pad pair is coincident with the first line;
a second differential signal pad pair positioned on a second line parallel to the first line, wherein a line drawn between the centers of the signal pads of the second differential signal pad pair is coincident with the second line, wherein:
the second differential signal pad pair is offset from the first differential signal pad, and
a line drawn normal to the first line and extending from a midpoint of the second differential signal pad pair does not intersect the first line at a midpoint of the first differential signal pad pair;
a plurality of ground pads on the surface of the printed circuit board, wherein a first subset of the plurality of ground pads are distributed along a ground pad line that is parallel to the first line and positioned between the first line and the second line; and
at least one of the ground pads is positioned along a line drawn from the midpoint of the first differential signal pad pair and the midpoint of the second differential signal pad pair.
|