US 12,294,986 B2
Systems and methods for application aware slicing in 5G layer 2 and layer 1 using fine grain scheduling
Vinay Ravuri, Cupertino, CA (US); and Sriram Rajagopal, Karnataka (IN)
Assigned to EdgeQ, Inc., Santa Clara, CA (US)
Filed by EdgeQ, Inc., Santa Clara, CA (US)
Filed on Aug. 7, 2023, as Appl. No. 18/230,869.
Application 18/230,869 is a continuation of application No. 18/082,555, filed on Dec. 15, 2022, granted, now 11,758,532.
Application 18/082,555 is a continuation of application No. 17/366,677, filed on Jul. 2, 2021, granted, now 11,576,190, issued on Feb. 7, 2023.
Prior Publication US 2023/0388996 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04W 72/12 (2023.01)
CPC H04W 72/12 (2013.01) 20 Claims
OG exemplary drawing
 
1. A method for resource allocation across wireless communication applications comprising:
receiving multiple scheduling tasks for multiple wireless communication applications; and
creating, at a wireless communication device comprising configurable processing resources, multiple computation instances in response to the multiple scheduling tasks.