US 12,294,845 B2
Package structure of micro speaker
Yu-Xuan Xu, Hsinchu (TW); Li-Jen Chen, Hsinchu (TW); Yu-Ting Cheng, New Taipei (TW); and Shih-Chin Gong, Taipei (TW)
Assigned to FORTEMEDIA, INC., Alviso, CA (US)
Filed by Fortemedia, Inc., Santa Clara, CA (US)
Filed on Jul. 1, 2022, as Appl. No. 17/856,105.
Prior Publication US 2024/0007793 A1, Jan. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 7/02 (2006.01)
CPC H04R 7/02 (2013.01) 20 Claims
OG exemplary drawing
 
1. A package structure of a micro speaker, comprising:
a substrate having a hollow chamber;
a polymer diaphragm suspended over the hollow chamber and being electrically insulating, wherein the polymer diaphragm comprises etching patterns recessed from a first surface of the polymer diaphragm and a cutting channel formed on and formed to the substrate and around the polymer diaphragm, wherein the etching patterns are smooth and symmetrical relative to an intersection in a top view;
a coil embedded in the polymer diaphragm and being separated from the etching patterns by the polymer diaphragm, wherein the coil comprises a first layer and a second layer, the first layer partially overlaps the second layer, and the first layer and the second layer are embedded in the polymer diaphragm;
at least one dielectric layer disposed between the polymer diaphragm and the substrate;
a carrier board disposed on a bottom surface of the substrate;
a first permanent magnetic element disposed on the carrier board and in the hollow chamber, wherein the first surface faces away from the first permanent magnetic element; and
a lid wrapped around the substrate and the polymer diaphragm, wherein an end of the lid exposes a portion of a top surface of the polymer diaphragm;
wherein the polymer diaphragm is made of a material different from the at least one dielectric layer.