US 12,294,822 B2
Transducer, antenna apparatus, wireless apparatus, and method for manufacturing transducer
Koh Hashimoto, Yokohama Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed on Oct. 9, 2023, as Appl. No. 18/483,015.
Application 18/483,015 is a division of application No. 17/654,078, filed on Mar. 9, 2022, granted, now 11,818,522.
Claims priority of application No. 2021-063520 (JP), filed on Apr. 2, 2021.
Prior Publication US 2024/0040293 A1, Feb. 1, 2024
Int. Cl. H04R 1/04 (2006.01); H04R 1/02 (2006.01)
CPC H04R 1/04 (2013.01) [H04R 1/026 (2013.01); H04R 2201/003 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A transducer comprising:
a first conductive member;
a substrate configured to form a first space with the first conductive member;
a second conductive member opposed to the first conductive member via the substrate interposed between the second conductive member and the first conductive member, and configured to form a second space with the substrate;
a plurality of first conductors through the substrate and configured to electrically connect the first conductive member with the second conductive member;
a first transmission conductor being on the substrate and being in at least one of the first space or the second space; and
a second transmission conductor being on the substrate, being in at least one of the first space or the second space, and separated from the first transmission conductor, wherein
the second conductive member includes a through hole through the second conductive member in a first direction in which the second conductive member is opposed to the first conductive member, and connecting to the second space, and
an orthogonal projection of the through hole in the first direction includes at least a portion of the first transmission conductor and at least a portion of the second transmission conductor,
wherein
the first conductive member includes a first recess,
the second conductive member includes a second recess,
the first space is formed by the first recess and the substrate,
the second space is formed by the second recess and the substrate,
the first conductive member includes a third recess having a depth in the first direction greater than a depth of the first recess in the first direction, and
the orthogonal projection of the through hole in the first direction further includes at least a portion of the third recess.