US 12,294,393 B2
Radio frequency module and communication apparatus
Yukiya Yamaguchi, Nagaokakyo (JP); and Teruaki Oshita, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Feb. 24, 2022, as Appl. No. 17/679,127.
Application 17/679,127 is a continuation of application No. PCT/JP2020/024593, filed on Jun. 23, 2020.
Claims priority of application No. 2019-158594 (JP), filed on Aug. 30, 2019.
Prior Publication US 2022/0393706 A1, Dec. 8, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/04 (2006.01)
CPC H04B 1/04 (2013.01) [H04B 2001/045 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A radio frequency module, comprising:
a mounting substrate having a first main surface and a second main surface that face each other;
a first transmission power amplifier mounted on the first main surface, the first transmission power amplifier amplifying a transmission signal in a first band group;
a first reception low noise amplifier mounted on the second main surface, the first reception low noise amplifier amplifying a reception signal in the first band group; and
a conductor arranged on a transmission path for transmitting a radio frequency signal in a second band group, the second band group having frequencies which do not overlap with frequencies of the first band group, wherein
the conductor is mounted on the first main surface or the second main surface, and
in a plan view, the conductor is between the first transmission power amplifier and the first reception low noise amplifier.