US 12,294,357 B2
Temperature sensor circuits for integrated circuit devices
Darryl G. Walker, San Jose, CA (US)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 6, 2021, as Appl. No. 17/313,327.
Claims priority of provisional application 63/029,598, filed on May 25, 2020.
Prior Publication US 2021/0366803 A1, Nov. 25, 2021
Int. Cl. G01K 1/14 (2021.01); G01K 3/00 (2006.01); G01K 7/01 (2006.01); G05F 3/26 (2006.01); G06F 1/08 (2006.01); G11C 11/402 (2006.01); G11C 11/406 (2006.01); G11C 11/419 (2006.01); H01L 23/34 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01); H03K 17/14 (2006.01)
CPC H03K 17/145 (2013.01) [G01K 1/14 (2013.01); G01K 3/005 (2013.01); G01K 7/01 (2013.01); G05F 3/265 (2013.01); G06F 1/08 (2013.01); G11C 11/4026 (2013.01); G11C 11/40626 (2013.01); G11C 11/419 (2013.01); H01L 23/34 (2013.01); H01L 27/092 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/78696 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit device, comprising:
a temperature sensor circuit, the temperature sensor circuit including at least one insulated gate field effect transistor (IGFET) including a plurality of substantially horizontally disposed channels that are substantially vertically aligned and a gate insulating layer surrounding each vertically aligned and horizontally disposed channel; and
wherein the temperature sensor circuit provides at least one temperature signal, the at least one temperature signal indicates a temperature window in which the integrated circuit device is operating.