US 12,294,312 B2
Low stray inductance busbar structure for power module
Xianye Mao, Shandong (CN); Jingya Sun, Shandong (CN); and Changcheng Wang, Shandong (CN)
Assigned to ZHENGHAI GROUP CO., LTD., Shandong (CN)
Appl. No. 18/020,067
Filed by ZHENGHAI GROUP CO., LTD., Shandong (CN)
PCT Filed Oct. 26, 2021, PCT No. PCT/CN2021/126304
§ 371(c)(1), (2) Date Feb. 6, 2023,
PCT Pub. No. WO2022/142640, PCT Pub. Date Jul. 7, 2022.
Claims priority of application No. 202011580372.8 (CN), filed on Dec. 28, 2020.
Prior Publication US 2023/0308027 A1, Sep. 28, 2023
Int. Cl. H02M 7/00 (2006.01); H02K 11/33 (2016.01); H05K 1/03 (2006.01)
CPC H02M 7/003 (2013.01) [H02K 11/33 (2016.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A busbar structure with less stray inductance for a power module, comprising:
a radiator;
a copper-clad ceramic substrate;
a wafer;
a plastic case;
a positive busbar;
a negative busbar; and
potting compound;
wherein the copper-clad ceramic substrate is welded on the radiator,
the wafer is welded on the copper-clad ceramic substrate,
the plastic case is fixed on the radiator,
the positive busbar and the negative busbar are packaged in the plastic case with the potting compound, and are fixed on the copper-clad ceramic substrate by ultrasonic bonding, to form an electrical circuit of the power module,
an electrical clearance between wafers as well as an electrical clearance between the positive busbar and the negative busbar are ensured by potting with the potting compound,
wherein a part of the positive busbar covers a part of the negative busbar, and the part of the positive busbar and the part of the negative busbar extend inside the plastic case and beyond a surface of the plastic case, and
wherein a width of the part of the positive busbar that covers the part of the negative busbar is larger than or equal to a length of the part of the positive busbar that covers the part of the negative busbar.