	US 12,294,161 B2
	Arrangement of a waveguide assembly and its manufacturing process
Emile de Rijk, Grand-Saconnex (CH); Mathieu Billod, Présilly (FR); Esteban Menargues Gomez, Préverenges (CH); Santiago Capdevila Cascante, Renens (CH); Tomislav Debogovic, Chexbres (CH); Alexandre Dimitriades, Nyon (CH); Lionel Simon, Lausanne (CH); and Arnaud Boland, Chavanne-des-Bois (CH)
Assigned to SWISSto12 SA, Renens (CH)
Appl. No. 17/601,554
Filed by SWISSto12 SA, Renens (CH)
PCT Filed Apr. 9, 2020, PCT No. PCT/IB2020/053399 § 371(c)(1), (2) Date Oct. 5, 2021, PCT Pub. No. WO2020/208574, PCT Pub. Date Oct. 15, 2020.
Claims priority of application No. 1903810 (FR), filed on Apr. 9, 2019.
Prior Publication US 2022/0181778 A1, Jun. 9, 2022
Int. Cl. H01Q 5/55 (2015.01); H01P 5/12 (2006.01); H01P 11/00 (2006.01); H01Q 1/28 (2006.01)

CPC H01Q 5/55 (2015.01) [H01P 11/002 (2013.01); H01Q 1/288 (2013.01); H01P 5/12 (2013.01)]

15 Claims

1. Arrangement for satellites comprising a payload bay, the arrangement comprising an assembly of waveguides, waveguide fixation interfaces for fixing the waveguides to electronic equipment and/or components and a mechanical structure comprising a plurality of links interconnecting at least some of the waveguides to ensure the stability of the assembly of waveguides, wherein the arrangement further comprises at least one heat pipe which is arranged to heat or cool one or more of the waveguides, wherein the arrangement is formed in a single piece by 3D printing, and wherein each link of the plurality of links either connects the heat pipe to at least one waveguide or connects at least one waveguide to another of the waveguides.