US 12,294,152 B2
Radio frequency module and wireless device
Takahiro Igarashi, Kanagawa (JP); and Shusaku Yanagawa, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/904,671
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jan. 18, 2021, PCT No. PCT/JP2021/001512
§ 371(c)(1), (2) Date Aug. 19, 2022,
PCT Pub. No. WO2021/171830, PCT Pub. Date Sep. 2, 2021.
Claims priority of application No. 2020-031766 (JP), filed on Feb. 27, 2020.
Prior Publication US 2023/0099457 A1, Mar. 30, 2023
Int. Cl. H01Q 21/06 (2006.01); H01Q 1/52 (2006.01); H01Q 15/00 (2006.01)
CPC H01Q 21/065 (2013.01) [H01Q 1/523 (2013.01); H01Q 15/008 (2013.01); H01Q 15/0086 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A radio frequency module, comprising:
a first interposer;
a plurality of antenna elements that includes a plurality of first electrodes and a second electrode, wherein
the plurality of first electrodes is on a first surface of the first interposer, and
the plurality of first electrodes is in a line arrangement in at least a first direction on the first surface; and
meta material portions at the first interposer, wherein
electromagnetic properties of the plurality of antenna elements are based on the meta material portions,
the meta material portions include electromagnetic band gap structures of specific geometric patterns on each of a first side of the line arrangement of the plurality of first electrodes and a second side of the line arrangement of the plurality of first electrodes, and
the first side of the line arrangement of the plurality of first electrodes is parallel to the second side of the line arrangement of the plurality of first electrodes.