US 12,294,138 B2
RFID module
Kengo Matsumoto, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Apr. 24, 2024, as Appl. No. 18/644,241.
Application 18/644,241 is a continuation of application No. PCT/JP2023/031799, filed on Aug. 31, 2023.
Claims priority of application No. 2022-140116 (JP), filed on Sep. 2, 2022; and application No. 2022-185616 (JP), filed on Nov. 21, 2022.
Prior Publication US 2024/0273329 A1, Aug. 15, 2024
Int. Cl. H01Q 1/22 (2006.01); G06K 19/077 (2006.01); H01Q 1/36 (2006.01); H01Q 7/00 (2006.01)
CPC H01Q 1/2208 (2013.01) [G06K 19/07722 (2013.01); G06K 19/0775 (2013.01); H01Q 1/36 (2013.01); H01Q 7/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An RFID module comprising:
a substrate having a first main surface and a second main surface that oppose each other;
an RFIC chip on the first main surface of the substrate;
a coil conductor on the first main surface of the substrate and including a plurality of coil elements that each have a pair of legs and a bridge that connects first ends of the pair of legs, the plurality of coil elements arranged in a row across a winding axis;
a first conductor pattern within the substrate; and
a second conductor pattern on the first main surface of the substrate and connected with the coil elements to form a coil shape,
wherein a first end of the RFIC chip is connected to a first end of the coil conductor,
wherein the first conductor pattern is connected between a second end of the RFIC chip and a second end of the coil conductor, and
wherein the first conductor pattern has a fold-back portion where a direction in which the first conductor pattern extends is folded back.