| CPC H01L 33/62 (2013.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/647 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01)] | 13 Claims |
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13. A light-emitting device, comprising:
a lead frame having a first surface on which a patterned conductive layer is provided; and
a light-emitting element including
an insulating substrate formed on said first surface of said lead frame,
four light-emitting units formed on said insulating substrate, said four light-emitting units being arranged in sequence, each of said four light-emitting units including an epitaxial structure and a conductive structure such that said epitaxial structure is in contact with said insulating substrate through said conductive structure, said epitaxial structure including a first semiconductor layer, an active layer and a second semiconductor layer which are sequentially disposed on said insulating substrate in such order, said conductive structure including a first electrically connecting layer which is electrically connected to said first semiconductor layer and a second electrically connecting layer which is electrically connected to said second semiconductor layer, said first electrically connecting layer and said second electrically connecting layer being separated and insulated from each other through an insulating layer, said second electrically connecting layer including first extension pieces and second extension pieces, wherein, in each of the four light-emitting units, said first extension pieces are in contact with said second semiconductor layer, and wherein said second extension pieces in a first one of said four light-emitting units are in contact with said first electrically connecting layer in a second one of said four light-emitting units, said second extension pieces in said second one of said four light-emitting units are in contact with said first electrically connecting layer in a third one of said four light-emitting units, and said second extension pieces in said third one of said four light-emitting units are in contact with said first electrically connecting layer in a fourth one of said four light-emitting units, such that said four light-emitting units are electrically connected in series,
at least one first electrode which is electrically connected to said first semiconductor layer of said first one of said four light-emitting units, and which is electrically connected to said patterned conductive layer through at least one first bonding wire, a projection of said first electrode on the insulating substrate being not overlapped with a projection of the epitaxial structure on the insulating substrate, and
at least one second electrode which is electrically connected to said second semiconductor layer of said fourth one of said four light-emitting units, and which is electrically connected to said patterned conductive layer through at least one second bonding wire, a projection of said second electrode on the insulating substrate being not overlapped with said projection of said epitaxial structure on the insulating substrate, wherein said at least one first electrode and said at least one second electrode are juxtaposed to each other, said first one of said four light-emitting units is located adjacent to said second one of said four light-emitting units and said fourth one of said four light-emitting units, and said first one of said four light-emitting units and said third one of said four light-emitting units are diagonally opposite to each other.
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