US 12,294,042 B2
Light emitting diodes and methods with encapsulation
Christopher P. Hussell, Cary, NC (US); and Zhenyu Zhong, TKO (HK)
Assigned to CreeLED, Inc., Durham, NC (US)
Filed by CreeLED, Inc., Durham, NC (US)
Filed on Mar. 31, 2016, as Appl. No. 15/087,641.
Claims priority of provisional application 62/141,065, filed on Mar. 31, 2015.
Prior Publication US 2016/0293811 A1, Oct. 6, 2016
Int. Cl. H01L 33/48 (2010.01); H01L 25/00 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/22 (2010.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01)
CPC H01L 33/52 (2013.01) [H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/22 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A light emitting diode (LED) apparatus comprising:
a substrate;
a plurality of electrically conductive top traces on the substrate, the plurality of electrically conductive top traces being entirely external to the substrate;
one or more light emitting diodes (LEDs) each comprising a bottom surface, a top surface opposite the bottom surface, and side surfaces that are between the top surface and the bottom surface, wherein the bottom surface is mounted to the substrate such that the one or more LEDs are electrically coupled to the plurality of electrically conductive top traces;
a dark encapsulation layer that surrounds the side surfaces of the one or more LEDs, wherein the dark encapsulation layer is less than 200 μm away from each of the side surfaces of the one or more LEDs, and wherein the dark encapsulation layer is coplanar, or within 25 μm or less, with the top surface of the one or more LEDs;
a reflective layer on the side surfaces of the one or more LEDs such that the reflective layer is arranged between the side surfaces of the one or more LEDs and the dark encapsulation layer, the reflective layer extends on a surface of the substrate adjacent the one or more LEDs, and the reflective layer is between the bottom surface of the one or more LEDs and the substrate; and
an additional layer that laterally extends over the one or more LEDs and a top surface of the dark encapsulation layer, the additional layer comprising one of:
a matte finish for reducing specular reflection;
a plurality of optics layers;
one or more diffractive elements;
liquid crystal elements or polarizing elements or both;
a layer of phosphor or other light converting elements; and
a plurality of light blocking elements.
 
20. A light emitting diode (LED) apparatus comprising:
a substrate comprising a plurality of electrically conductive top traces;
at least one light emitting diode (LED) on the substrate such that the at least one LED is electrically coupled to the plurality of electrically conductive top traces, the LED comprising a light emitting surface;
a dark encapsulation layer with a top surface that is coplanar, or within 25 μm or less, with the light emitting surface of the LED; and
an additional layer that laterally extends over the LED and the dark encapsulation layer such that the additional layer laterally extends over the top surface of the dark encapsulation layer, the additional layer comprising at least one of:
a matte finish for reducing specular reflection;
a plurality of optics layers;
one or more diffractive elements;
liquid crystal elements or polarizing elements or both;
a layer of phosphor or other light converting elements; and
a plurality of light blocking elements.
 
27. A panel comprising:
a sub-panel layer; and
a plurality of RGB component arrays on the sub-panel layer, each RGB component array comprising a plurality of components; and
wherein at least one component of the plurality of components comprises:
a substrate comprising a plurality of electrically conductive top traces;
one or more light emitting diodes (LEDs), each of which comprises a bottom surface, a top surface opposite the bottom surface, and side surfaces that are between the top surface and the bottom surface, wherein the bottom surface is mounted to the substrate such that the one or more LEDs are electrically coupled to the plurality of electrically conductive top traces;
a dark encapsulation layer surrounding the one or more LEDs wherein a top surface of the dark encapsulation layer is coplanar, or within 25 μm or less, with the top surface of the one or more LEDs;
a reflective layer on the side surfaces of the one or more LEDs such that the reflective layer is arranged between the side surfaces of the one or more LEDs and the dark encapsulation layer, the reflective layer extends on a surface of the substrate adjacent the one or more LEDs, and the reflective layer is between the bottom surface of the one or more LEDs and the substrate; and
an additional layer that laterally extends over the LED and the dark encapsulation layer such that the additional layer laterally extends over the top surface of the dark encapsulation layer, the additional layer comprising at least one of:
a matte finish for reducing specular reflection;
a plurality of optics layers;
one or more diffractive elements;
liquid crystal elements or polarizing elements or both;
a layer of phosphor or other light converting elements; and
a plurality of light blocking elements.