	US 12,294,038 B2
	Method for manufacturing light emitting device
Kai Cheng, Miao-Li County (TW); Tsau-Hua Hsieh, Miao-Li County (TW); Jian-Jung Shih, Miao-Li County (TW); Fang-Ying Lin, Miao-Li County (TW); Hui-Chieh Wang, Miao-Li County (TW); and Wan-Ling Huang, Miao-Li County (TW)
Assigned to Innolux Corporation, Miaoli County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on Apr. 10, 2023, as Appl. No. 18/298,343.
Application 18/298,343 is a continuation of application No. 16/853,723, filed on Apr. 20, 2020, granted, now 11,658,262.
Claims priority of provisional application 62/873,191, filed on Jul. 12, 2019.
Prior Publication US 2023/0246121 A1, Aug. 3, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/00 (2010.01); H01L 25/075 (2006.01)

CPC H01L 33/0095 (2013.01) [H01L 25/0753 (2013.01); H01L 2933/0066 (2013.01)]

12 Claims

1. A method for manufacturing an electronic device, comprising:

providing a substrate with elements disposed thereon;

attaching the elements to a carrier;

removing the substrate; and

transferring a portion of the elements from the carrier to a driving substrate, wherein transferring the portion of the elements from the carrier to the driving substrate comprises:

transferring the portion of the elements from the carrier to another carrier, which comprises illuminating regions of the carrier overlapped with the portion of the elements by an energy beam; and

transferring the portion of the elements from the another carrier to the driving substrate,

wherein a gap between the carrier and the another carrier when the carrier is illuminated by the energy beam is in a range from 1 μm to 300 μm.