| CPC H01L 29/945 (2013.01) [H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 28/91 (2013.01)] | 20 Claims |
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1. A semiconductor die, comprising:
first capacitor cell structures defined in a substrate, wherein each first capacitor cell structure comprises a plurality of first trench segments having a predetermined first length extending along a surface of the substrate, the plurality of first trench segments characterized by a first trench width and a first spacing between adjacent first trench segments, wherein a given first trench segment includes:
a stack of alternating electrode layers and capacitor dielectric layers overlying a bottom region and sidewalls of the given first trench segment; and
a gap-filling dielectric material filling a space in the given first trench segment not filled by the stack of alternating electrode layers and capacitor dielectric layers and leaving an air gap of a first gap width in the given first trench segment;
second capacitor cell structures defined in the substrate, wherein each second capacitor cell structures comprises a plurality of second trench segments having a predetermined second length extending along the surface of the substrate, the plurality of second trench segments characterized by a second trench width and a second trench spacing between adjacent second trench segments, wherein a given second trench segment includes:
a stack of alternating electrode layers and capacitor dielectric layers overlying a bottom region and sidewalls of the given second trench segments; and
a gap-filling dielectric material filling a space in the given second trench segment not filled by the stack of alternating electrode layers and capacitor dielectric layers and leaving an air gap of a second gap width in the given second trench segment;
wherein:
the second trench width is greater than the first trench width by 10% or more;
the second trench spacing is less than the first trench spacing by 20% or more; and
the second air gap width is greater than the first air gap width by 20% or more;
wherein the semiconductor die comprises:
an array of first capacitor regions, each of the first capacitor regions including multiple first capacitor cell structures; and
a plurality of second capacitor regions interspersed in the array of first capacitor regions, each of the second capacitor regions including multiple second capacitor cell structures;
wherein:
each first capacitor region is configured to provide a capacitance between a first capacitor electrode and a second capacitor electrode connected to respective alternating electrode layers in the first capacitor cell structures; and
each second capacitor region provides no capacitor electrodes, and each second capacitor region is configured to provide structural variation with different trench width, trench spacing, and air gap width from the first capacitor region.
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