US 12,294,009 B2
Display panel and method for manufacturing same
Bin Zhao, Guangdong (CN); Juncheng Xiao, Guangdong (CN); and Xiaodan Lin, Guangdong (CN)
Assigned to Huizhou China Star Optoelectronics Display Co., Ltd., Huizhou (CN); and TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen (CN)
Appl. No. 17/622,884
Filed by Huizhou China Star Optoelectronics Display Co., Ltd., Guangdong (CN); and TCL China Star Optoelectronics Technology Co., Ltd., Guangdong (CN)
PCT Filed Dec. 17, 2021, PCT No. PCT/CN2021/139183
§ 371(c)(1), (2) Date Dec. 27, 2021,
PCT Pub. No. WO2023/103041, PCT Pub. Date Jun. 15, 2023.
Claims priority of application No. 202111498857.7 (CN), filed on Dec. 9, 2021.
Prior Publication US 2024/0038775 A1, Feb. 1, 2024
Int. Cl. H01L 27/12 (2006.01); H01L 25/16 (2023.01)
CPC H01L 27/124 (2013.01) [H01L 25/167 (2013.01); H01L 27/1259 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A display panel, comprising a first bonding area and a second bonding area connected to the first bonding area, and further comprising:
a substrate, wherein a thickness of a part of the substrate in the second bonding area is less than a thickness of a part of the substrate in the first bonding area; and
a bonding wiring layer disposed on the substrate and in the first bonding area and the second bonding area, wherein a side surface of the bonding wiring layer away from the first bonding area and a side surface of the substrate away from the first bonding area are located on a same plane,
wherein the substrate comprises a first surface and a second surface closer to the bonding wiring layer than the first surface and opposite the first surface, in a direction perpendicular to the first surface, a distance between a surface of the bonding wiring layer away from the substrate and the first surface in the second bonding area is greater than a distance between the first surface and the second surface in the first bonding area,
wherein the substrate comprises: a body portion located in the first bonding area; and an extension portion connected with the body portion and located in the second bonding area,
wherein the bonding wiring layer comprises: a first metal layer disposed on the body portion and extending from the body portion to the extension portion; and a second metal layer disposed on a surface of the first metal layer away from the substrate, and
wherein a total thickness of the body portion and the first metal layer is less than a total thickness of the extension portion, the first metal layer, and the second metal layer.