US 12,294,001 B2
Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method therefor
Tatsuya Yahata, Tokyo (JP); Kohei Taniguchi, Tokyo (JP); Shintaro Hashimoto, Tokyo (JP); and Yoshinobu Ozaki, Tokyo (JP)
Appl. No. 17/439,400
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed Apr. 24, 2020, PCT No. PCT/JP2020/017731
§ 371(c)(1), (2) Date Sep. 15, 2021,
PCT Pub. No. WO2020/218526, PCT Pub. Date Oct. 29, 2020.
Claims priority of application No. PCT/JP2019/017688 (WO), filed on Apr. 25, 2019.
Prior Publication US 2022/0149031 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/50 (2013.01) [H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 24/48 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/83874 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A manufacturing method for a semiconductor device having a dolmen structure, the semiconductor device comprising: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip on the substrate; and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, the method comprising:
preparing a laminate film comprising a base material film, an adhesive layer, and a support piece formation film in order, wherein the support piece formation film is constituted of one or more resin layers;
singulating the support piece formation film into singulated pieces of the support piece formation film;
picking up the singulated pieces from the adhesive layer, wherein the picked-up singulated pieces that are separated from the adhesive layer correspond to the support pieces, and wherein the support pieces have lower surfaces formed by a thermosetting resin of the support piece formation film, and upper surfaces formed by the thermosetting resin;
disposing the first chip at a given region on a surface of the substrate;
disposing the plurality of support pieces around the given region, wherein the lower surfaces of the plurality of support pieces are in contact with the surface of the substrate;
preparing an adhesive piece-attached chip comprising the second chip and a bonding adhesive piece provided on one surface of the second chip, wherein the bonding adhesive piece forms a lower surface of the adhesive piece-attached chip; and
constructing the dolmen structure after preparing the adhesive piece-attached chip, by disposing the adhesive piece-attached chip on the plurality of support pieces, wherein the lower surface of the adhesive piece-attached chip that is formed by the bonding adhesive piece is brought into contact with the upper surfaces of the plurality of support pieces.