US 12,294,000 B2
Fingerprint sensor package and smart card having the same
Jaehyun Lim, Suwon-si (KR); Kwangjin Lee, Suwon-si (KR); Hyunjong Moon, Suwon-si (KR); and Inho Choi, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 24, 2023, as Appl. No. 18/322,795.
Claims priority of application No. 10-2022-0121753 (KR), filed on Sep. 26, 2022.
Prior Publication US 2024/0105703 A1, Mar. 28, 2024
Int. Cl. G06K 19/073 (2006.01); G06V 40/13 (2022.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 25/18 (2013.01) [G06K 19/07354 (2013.01); G06V 40/1306 (2022.01); G06V 40/1329 (2022.01); H01L 23/5388 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 25/50 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/84 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40101 (2013.01); H01L 2224/40106 (2013.01); H01L 2224/40157 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/4103 (2013.01); H01L 2224/41051 (2013.01); H01L 2224/41176 (2013.01); H01L 2224/73205 (2013.01); H01L 2224/84005 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/0665 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A fingerprint sensor package comprising:
a first substrate including a core insulating layer including a first surface and an opposite second surface and a through-hole extending through the first and second surfaces, a first bonding pad disposed along a circumference of the through-hole on the second surface of the core insulating layer, and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad;
a second substrate in the through-hole of the core insulating layer and including a third surface and an opposite fourth surface, the second substrate including a plurality of first sensing patterns on the third surface, spaced apart in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface;
a conductive support vertically overlapping the first substrate and the second substrate, supporting the first substrate and the second substrate below the first substrate and the second substrate, and electrically connecting the first bonding pad and the second bonding pad to each other;
a controller chip on the second substrate; and
a molding layer on the second surface of the core insulating layer, at least partially filling the through-hole between the first substrate and the second substrate, covering at least a portion of the second substrate and the first bonding pad, and spaced apart from the external connection pad.