US 12,293,997 B2
3D printable feedstock inks for signal control or computation
Maxwell Murialdo, Westminster, CA (US); Yuliya Kanarska, Livermore, CA (US); and Andrew J. Pascall, Livermore, CA (US)
Assigned to Lawrence Livermore National Security, LLC, Livermore, CA (US)
Filed by Lawrence Livermore National Security, LLC, Livermore, CA (US)
Filed on Aug. 17, 2023, as Appl. No. 18/451,234.
Application 18/451,234 is a division of application No. 17/375,788, filed on Jul. 14, 2021, granted, now 12,027,507.
Application 17/375,788 is a division of application No. 16/219,188, filed on Dec. 13, 2018, granted, now 11,101,255, issued on Aug. 24, 2021.
Prior Publication US 2024/0006390 A1, Jan. 4, 2024
Int. Cl. H01L 25/16 (2023.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H05K 1/16 (2006.01); H05K 3/30 (2006.01)
CPC H01L 25/16 (2013.01) [H01L 25/07 (2013.01); H01L 25/50 (2013.01); H05K 1/16 (2013.01); H05K 3/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming an electrically conductive ink able to be deposited through a print nozzle during a 3D printing operation, comprising:
providing an electrically non-conductive flowable material adapted to be flowed through a print nozzle during a 3D printing operation;
mixing a predetermined quantity of chiplets, in accordance with a predefined percolation threshold, into the non-conductive flowable material to form a percolating chiplet network within the polymer as the ink is flowed through the print nozzle and deposited on a surface, wherein the chiplets each form an engineered electronic component, and ones of the chiplets randomly connect, in accordance with the predefined percolation threshold, to form an electrically conductive circuit having a predetermined circuit characteristic.