US 12,293,984 B2
Method for packaging stacking flip chip
Honglei Ran, Shijiazhuang (CN); Kui Zhang, Shijiazhuang (CN); Shanbin Xi, Shijiazhuang (CN); Hao Peng, Shijiazhuang (CN); Huaguang Liu, Shijiazhuang (CN); and Hailong Zhao, Shijiazhuang (CN)
Assigned to Hebei Beixin Semiconductor Technology Co., Ltd., Shijiazhuang (CN)
Filed by HEBEI BEIXIN SEMICONDUCTOR TECHNOLOGY CO., LTD, Shijiazhuang (CN)
Filed on Sep. 12, 2024, as Appl. No. 18/884,085.
Application 18/884,085 is a continuation of application No. PCT/CN2023/103877, filed on Jun. 29, 2023.
Claims priority of application No. 202211478794.3 (CN), filed on Nov. 24, 2022.
Prior Publication US 2025/0006692 A1, Jan. 2, 2025
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01)
CPC H01L 24/83 (2013.01) [H01L 21/563 (2013.01); H01L 24/27 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/02126 (2013.01); H01L 2224/02135 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/02175 (2013.01); H01L 2224/02235 (2013.01); H01L 2224/02245 (2013.01); H01L 2224/03013 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/10156 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/2747 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32053 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83948 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92125 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A method for packaging stacking a flip chip, comprising:
welding solder joints at a preset position on a substrate for solder ball bonding;
uniformly coating a filling material around at least a portion of solder balls on a chip and around at least a portion of the solder joints on the substrate to form a first filling body, the filling material being a polymer composite material comprising an epoxy resin matrix, a curing agent, and a promoter;
bonding the solder joints and the solder balls such that the at least a portion of the solder balls is covered by the first filling body, and gaps are provided between the at least a portion of the solder balls covered with the first filling body; and
heating and curing the first filling body, and after heating and curing the first filling body, the method further comprises:
filling a preset area between the chip and the substrate with the filling material, such that an air cavity is formed in a middle between the chip and the substrate, the preset area being an area between the solder balls located on a most periphery and a boundary of the chip.