US 12,293,983 B2
Conductive pillar, method for manufacturing the same, and method for manufacturing bonded structure
Ryota Yamaguchi, Sakura (JP); and Makoto Yada, Sakura (JP)
Assigned to DIC CORPORATION, Tokyo (JP)
Appl. No. 17/791,652
Filed by DIC Corporation, Tokyo (JP)
PCT Filed Dec. 17, 2020, PCT No. PCT/JP2020/047075
§ 371(c)(1), (2) Date Jul. 8, 2022,
PCT Pub. No. WO2021/145129, PCT Pub. Date Jul. 22, 2021.
Claims priority of application No. 2020-005885 (JP), filed on Jan. 17, 2020; and application No. 2020-042068 (JP), filed on Mar. 11, 2020.
Prior Publication US 2023/0041521 A1, Feb. 9, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/11 (2013.01) [H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11505 (2013.01); H01L 2224/1181 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for manufacturing a conductive pillar including an electrode pad, a first bonding layer formed of a thin Cu film on the electrode pad, and a sintered body of fine copper particles on the first bonding layer, the method comprising, in sequence, the steps of:
forming a thin Cu film by sputtering or evaporating Cu on a surface of a substrate provided with an electrode pad;
forming a resist layer on the thin Cu film, the resist layer including an opening portion above the electrode pad;
filling the opening portion with a fine particle copper paste; and
sintering the fine particle copper paste by heating the substrate filled with the fine particle copper paste.