US 12,293,980 B2
Package comprising discrete antenna device
Jaehyun Yeon, San Diego, CA (US); Suhyung Hwang, Rancho Mission Viejo, CA (US); Chin-Kwan Kim, San Diego, CA (US); Rajneesh Kumar, San Diego, CA (US); and Darryl Sheldon Jessie, San Diego, CA (US)
Assigned to QUALCOMM INCORPORATED, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on May 8, 2020, as Appl. No. 16/870,642.
Claims priority of provisional application 62/903,378, filed on Sep. 20, 2019.
Prior Publication US 2021/0091017 A1, Mar. 25, 2021
Int. Cl. H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 5/307 (2015.01); H01Q 9/16 (2006.01); H01Q 21/06 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5383 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01Q 5/307 (2015.01); H01Q 9/16 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1904 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19101 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a substrate comprising a first surface and a second surface, wherein the substrate comprises a plurality of interconnects;
first means for transmitting and receiving a first signal, coupled to the first surface of the substrate, through a first plurality of solder interconnects, wherein a portion of the first means for transmitting and receiving the first signal, overhangs over the substrate such that a portion of the first means for transmitting and receiving the first signal does not vertically overlap with any portion of the substrate;
second means for transmitting and receiving a second signal, coupled to the first surface of the substrate, through a second plurality of solder interconnects;
an integrated device coupled to the second surface of the substrate;
means for encapsulation coupled to the second surface of the substrate,
wherein a vertical surface of the means for encapsulation is coplanar with a vertical surface of the substrate, and
wherein the means for encapsulation encapsulates the integrated device; and
means for shielding coupled to a surface of the means for encapsulation, wherein the means for shielding is configured to provide electromagnetic interference (EMI) shielding.