CPC H01L 23/552 (2013.01) [H05K 1/0216 (2013.01); H05K 9/0081 (2013.01); H05K 9/0024 (2013.01); H05K 9/0052 (2013.01); H05K 9/0071 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/10371 (2013.01)] | 17 Claims |
15. A method of assembling a circuit board system, the method comprising:
positioning a first circuit board and a second circuit board in a first spatial orientation relative to one another; and
fixing substrates of the first and second circuit boards in the first spatial orientation, wherein the fixing of the substrates comprises:
passing an elongate flexible circuit secured to the first circuit through a coupling opening defined by a locking formation integrated with a substrate of the second circuit board, such that a distal end portion of the flexible circuit projects beyond the coupling opening, the flexible circuit being non-resiliently deformable such that it is capable of holding a non-linear shape manually applied thereto; and
manually deforming the distal end portion of the flexible circuit to include a non-rectilinear irregularity, withdrawal of the distal end portion from the coupling opening of the locking formation being prevented by obstruction of the irregularity against the locking formation opening.
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