US 12,293,977 B2
Semiconductor package including shielding cover that covers molded body
Young-Woo Park, Cheonan-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jan. 31, 2024, as Appl. No. 18/429,039.
Application 18/429,039 is a division of application No. 17/117,547, filed on Dec. 10, 2020, granted, now 11,923,319.
Application 17/117,547 is a continuation of application No. 16/224,556, filed on Dec. 18, 2018, granted, now 10,943,872, issued on Mar. 9, 2021.
Claims priority of application No. 10-2018-0073589 (KR), filed on Jun. 26, 2018.
Prior Publication US 2024/0213177 A1, Jun. 27, 2024
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/053 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2224/48157 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/3025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a package substrate;
at least one semiconductor chip on an upper surface of the package substrate;
a conductive wall that extends around sides of the at least one semiconductor chip above the package substrate;
a molded body covering the at least one semiconductor chip and at least a portion of the upper surface of the package substrate;
a shielding cover that covers the molded body and the conductive wall; and
an adhesive between the conductive wall and the package substrate,
wherein the package substrate comprises a base, a solder resist layer on an upper surface of the base, and a protrusion contacting the base and extending into the solder resist layer, and
the protrusion is electrically connected to the conductive wall.