US 12,293,962 B2
Flip chip and chip packaging structure
Yong Yu, Beijing (CN); Xuerui Gong, Beijing (CN); and Chang Zhang, Beijing (CN)
Assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/765,298
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed May 20, 2021, PCT No. PCT/CN2021/094916
§ 371(c)(1), (2) Date Mar. 30, 2022,
PCT Pub. No. WO2022/001465, PCT Pub. Date Jan. 6, 2022.
Claims priority of application No. 202010601611.7 (CN), filed on Jun. 28, 2020.
Prior Publication US 2022/0367328 A1, Nov. 17, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/4985 (2013.01); H01L 23/49866 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A flip-chip, comprising:
a driver chip having a package surface facing a wiring substrate;
a plurality of conductive connectors, wherein any one of the plurality of conductive connectors comprises a conductive bump connected to the package surface and a conductive extension portion on a side of the conductive bump away from the driver chip; and
a plurality of insulating bumps connected to the package surface, wherein a distance between the package surface and one end of each of the insulating bumps away from the package surface is smaller than a size of each of the conductive connectors along a direction perpendicular to the package surface;
wherein the plurality of insulating bumps comprise a first insulating bump and a second insulating bump, a distance between the first insulating bump and a side edge of the driver chip is smaller than a distance between the second insulating bump and the side edge of the driver chip; and
wherein along the direction perpendicular to the package surface, a size of the first insulating bump is larger than a size of the second insulating bump;
wherein the driver chip further comprises an electromagnetic shielding structure, the electromagnetic shielding structure comprises a shielding metal layer on the package surface, and the shielding metal layer is loaded with a ground signal of the driver signal;
wherein a melting point of the conductive extension portion is lower than a melting point of the conductive bump, and the melting point of the conductive extension portion is lower than a melting point of a metal via in the wiring substrate.