US 12,293,953 B2
Edge bend for isolation packages
John Paul Tellkamp, Rockwall, TX (US); and Chang-Yen Ko, Taipei (TW)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Dec. 10, 2019, as Appl. No. 16/709,497.
Application 16/709,497 is a continuation of application No. 16/028,179, filed on Jul. 5, 2018, abandoned.
Claims priority of provisional application 62/571,091, filed on Oct. 11, 2017.
Prior Publication US 2020/0118899 A1, Apr. 16, 2020
Int. Cl. H01L 23/31 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/3114 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49575 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first die pad;
an electronic component, attached to the first die pad, and electrically connected to at least a first lead, and electrically isolated from a second lead; and
mold compound covering portions of the first die pad and the electronic component, wherein the second lead includes:
a first end portion covered by the mold compound, and at least two first internal portions covered by the mold compound, and at least two second end portions external to the mold compound; wherein a plane along a surface of the first end portion is at an angle with respect to a plane along a surface of the first die pad; and wherein the first end portion is free standing within the semiconductor package supported by the mold compound.