US 12,293,952 B2
Electronic package and manufacturing method thereof
Ho-Chuan Lin, Taichung (TW); Min-Han Chuang, Taichung (TW); and Chia-Chu Lai, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on May 9, 2024, as Appl. No. 18/659,692.
Application 18/215,113 is a division of application No. 17/368,475, filed on Jul. 6, 2021, granted, now 11,728,234, issued on Aug. 15, 2023.
Application 18/659,692 is a continuation of application No. 18/215,113, filed on Jun. 27, 2023, granted, now 12,014,967.
Claims priority of application No. 110116024 (TW), filed on May 4, 2021.
Prior Publication US 2024/0290675 A1, Aug. 29, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 21/56 (2013.01); H01L 23/5286 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic package, comprising:
providing a first electronic component including at least one conductive layer on a surface of the first electronic component, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface, wherein at least one electrode pad is disposed on the active surface, and at least one wire electrically connected with the electrode pad is provided inside the first electronic component, such that the conductive layer is electrically connected with the wire; and
embedding the first electronic component along with the conductive layer in an encapsulant.