US 12,293,948 B2
Flip chip semiconductor device package with mold compound seal
Amit Sureshkumar Nangia, Murphy, TX (US); and Gregory Thomas Ostrowicki, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Sep. 28, 2021, as Appl. No. 17/487,318.
Prior Publication US 2023/0102688 A1, Mar. 30, 2023
Int. Cl. H01L 23/10 (2006.01); H01L 21/67 (2006.01); H01L 23/06 (2006.01); H03H 9/02 (2006.01)
CPC H01L 23/10 (2013.01) [H01L 21/67126 (2013.01); H01L 23/06 (2013.01); H03H 9/02007 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a semiconductor die with a component on a device side surface;
post connects extending from the device side surface of the semiconductor die;
a die seal surrounding the component on the device side surface of the semiconductor die;
a package substrate having bond pads on a die side surface and having a board side surface opposite the die side surface;
a package substrate seal formed on the die side surface of the package substrate corresponding to the die seal on the semiconductor die;
the semiconductor die flip chip mounted on the bond pads of the package substrate, with solder joints connecting the post connects of the semiconductor die to the bond pads of the package substrate;
a mold compound seal formed by the die seal and the package substrate seal; and
a mold compound covering a portion of the semiconductor die and a portion of the die side surface of the package substrate, and contacting the mold compound seal, the mold compound spaced from the component.