US 12,293,945 B2
Semiconductor chip and method for manufacturing the same
Shinichi Hoshi, Nisshin (JP); Masatake Nagaya, Nisshin (JP); Chiaki Sasaoka, Nagoya (JP); Daisuke Kawaguchi, Hamamatsu (JP); and Keisuke Hara, Hamamatsu (JP)
Assigned to DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); MIRISE Technologies Corporation, Nisshin (JP); National University Corporation Tokai National Higher Education and Research System, Nagoya (JP); and HAMMATSU PHOTONICS K.K., Hamamatsu (JP)
Filed by DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); MIRISE Technologies Corporation, Nisshin (JP); National University Corporation Tokai National Higher Education and Research System, Nagoya (JP); and HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Filed on Mar. 30, 2022, as Appl. No. 17/708,490.
Claims priority of application No. 2021-076935 (JP), filed on Apr. 29, 2021.
Prior Publication US 2022/0352027 A1, Nov. 3, 2022
Int. Cl. H01L 21/78 (2006.01); H01L 21/02 (2006.01); H10D 30/47 (2025.01); H10D 62/85 (2025.01)
CPC H01L 21/7813 (2013.01) [H01L 21/02389 (2013.01); H01L 21/0254 (2013.01); H10D 30/475 (2025.01); H10D 62/8503 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor chip comprising:
a chip constituent substrate having a first surface and a second surface opposite to the first surface, the chip constituent substrate including a gallium nitride substrate adjacent to the second surface and a layer containing gallium nitride adjacent to the first surface, the chip constituent substrate provided with a semiconductor element, wherein
the semiconductor element is disposed such that components constituting the semiconductor element are located more in an area adjacent to the first surface than in an area adjacent to the second surface,
the chip constituent substrate is formed with a plurality of through holes, as gas vent holes,
each of the through holes penetrates the chip constituent substrate from the first surface to the second surface and defines a first opening adjacent to the first surface and a second opening adjacent to the second surface,
the first opening is larger than the second opening, and
a density of the through holes is 100/cm2 or more.