US 12,293,939 B2
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
Daigi Kamimura, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Oct. 13, 2023, as Appl. No. 18/486,786.
Application 18/486,786 is a continuation of application No. 16/818,510, filed on Mar. 13, 2020, granted, now 11,823,946.
Application 16/818,510 is a continuation of application No. PCT/JP2018/009963, filed on Mar. 14, 2018.
Claims priority of application No. 2017-183183 (JP), filed on Sep. 25, 2017.
Prior Publication US 2024/0038576 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/687 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68764 (2013.01) [H01J 37/3244 (2013.01); H01L 21/67017 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a process chamber in which a substrate is processed;
a process gas supply system configured to supply a process gas into the process chamber;
a rotating mechanism configured to rotate the substrate; and
a controller configured to control the process gas supply system and the rotating mechanism to supply the process gas in a state where the substrate is stopped while a cycle of supplying the process gas is performed a predetermined number of times; and rotate the substrate by a predetermined angle obtained by dividing a circumference of the substrate equally by the predetermined number of times while the process gas is not supplied to the substrate.