US 12,293,938 B2
Wafer processing apparatus and wafer processing method
Woon Kong, Cheonan-si (KR); Ji Hoon Song, Cheonan-si (KR); Ung Jo Moon, Osan-si (KR); Ji Ho Park, Hwaseong-si (KR); and Won Seok Choi, Hwaseong-si (KR)
Assigned to ZEUS CO., LTD., Hwaseong-si (KR)
Filed by ZEUS CO., LTD., Hwaseong-si (KR)
Filed on Aug. 20, 2021, as Appl. No. 17/407,531.
Claims priority of application No. 10-2020-0106759 (KR), filed on Aug. 25, 2020.
Prior Publication US 2022/0068699 A1, Mar. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/68764 (2013.01) [H01L 21/67126 (2013.01); H01L 21/6838 (2013.01); H01L 21/68792 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A wafer processing apparatus comprising:
a rotating chuck rotatably installed on a driver;
a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated;
a ring cover disposed along a circumferential portion of the vacuum chuck to seal the circumferential portion of the vacuum chuck; and
a movable chuck installed in the rotating chuck to fix the ring cover to the rotating chuck,
wherein the movable chuck further includes a chuck base installed on the rotating chuck and a plurality of first chuck links radially connected to the chuck base and moved when the chuck base is rotated.