US 12,293,934 B2
Using controlled gas pressure for backside wafer support
Paul Steffas, Santa Clara, CA (US); and Kenneth S. Ledford, San Jose, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 10, 2022, as Appl. No. 17/647,543.
Claims priority of provisional application 63/136,046, filed on Jan. 11, 2021.
Prior Publication US 2022/0223462 A1, Jul. 14, 2022
Int. Cl. H01L 21/683 (2006.01); C23C 16/458 (2006.01); C23C 16/50 (2006.01)
CPC H01L 21/6838 (2013.01) [C23C 16/4586 (2013.01); C23C 16/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate support assembly, comprising:
a lower plate;
an upper plate coupled to the lower plate, the upper plate disposed on a top surface of the lower plate, the upper plate having:
an upper surface;
a retention surface disposed below the upper surface;
a lip formed between the upper surface and the retention surface; and
a plurality of vacuum slots disposed through the retention surface;
at least two arcuate extensions disposed at a perimeter of the lower plate and the upper plate, the extensions operable to move into a raised position and a lowered position;
an end effector operable to position a substrate having a first surface and a second surface opposite the first surface onto the extensions disposed in the raised position, wherein the end effector is in direct contact with an exclusion zone on the second surface; and
a gas nozzle disposed through the upper plate and operable to provide a gas to active areas of the second surface of the substrate at a direction perpendicular to the second surface of the substrate, wherein
the plurality of vacuum slots are operable to provide a vacuum pressure to the exclusion zone of the substrate.