US 12,293,933 B2
Electrostatic chuck with multiple heater zones
Woo Hyung Choi, Seongnam-si (KR); and Sang Woo Lee, Suwon-si (KR)
Assigned to VM INC., Icheon (KR)
Filed by Adaptive Plasma Technology Corp., Icheon-si (KR)
Filed on Dec. 15, 2021, as Appl. No. 17/551,857.
Prior Publication US 2023/0187251 A1, Jun. 15, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67103 (2013.01)] 3 Claims
OG exemplary drawing
 
1. An electrostatic chuck with multiple heater zones, the electrostatic chuck comprising:
multiple heater zones formed within a ceramic layer, wherein each of the multiple heater zones is configured to be heated individually by a corresponding heating element, and each of the multiple heater zones is configured to heat independently each corresponding partial area of a wafer secured on the electrostatic chuck;
a switch module having each switching means connected to each of the heater zones;
a switch controlling module for controlling an operation of the switch module;
multiple AC heater zones formed above the multiple heater zones within the ceramic layer and operating independently from the multiple heater zones, wherein the multiple AC heater zones are coupled to an AC power source and correspond to the multiple heater zone, respectively;
multiple semiconductor switches coupled to the multiple AC heater zones, respectively, and configured to heat the multiple AC heater zones individually and independently, wherein the multiple AC zones, the multiple semiconductor switches and the AC power source form multiple heating circuits operating individually and independently;
an operating body formed under the ceramic layer and made of an aluminum;
a cooling line formed within the operating body;
a heating regulation area formed between the operating body and the ceramic layer and filled with a thermal paste;
a zone board formed within the heating regulation area and spaced apart from a bottom of the heating regulation area, wherein the ceramic layer is disposed on the zone board; and
an optical communicating circuit module configured to deliver controlling information to a driving module and a power circuit module disposed on a lower surface of the zone board,
wherein the multiple AC heater zone is configured to heat the wafer and the multiple heater zone is configured to perform a temperature compensation on the heated wafer.