US 12,293,932 B2
Substrate processing apparatus, elevator and method of manufacturing semiconductor device
Yuji Takebayashi, Toyama (JP); Makoto Hirano, Toyama (JP); Koji Shibata, Toyama (JP); and Yusaku Okajima, Toyama (JP)
Assigned to KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed by KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed on Mar. 10, 2022, as Appl. No. 17/691,641.
Application 17/691,641 is a continuation of application No. PCT/JP2019/038175, filed on Sep. 27, 2019.
Prior Publication US 2022/0199443 A1, Jun. 23, 2022
Int. Cl. H01L 21/677 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67757 (2013.01) [C23C 16/402 (2013.01); C23C 16/4412 (2013.01); C23C 16/4584 (2013.01); C23C 16/52 (2013.01); H01L 21/02164 (2013.01); H01L 21/0217 (2013.01); H01L 21/02186 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a substrate retainer comprising:
a substrate support configured to support a plurality of substrates at intervals in a vertical direction; and
a partition plate support configured to support a plurality of partition plates arranged between the plurality of substrates supported by the substrate support;
a reaction tube configured to accommodate the substrate retainer in which the plurality of substrates are supported by the substrate support;
a first driver configured to move the substrate retainer in the vertical direction to transfer the substrate retainer into or out of the reaction tube;
a second driver moved by the first driver in the vertical direction together with the substrate retainer, and configured to rotate the substrate retainer in a state where the substrate retainer is inserted in the reaction tube and to change a distance between each of the plurality of substrates supported by the substrate support and each of the plurality of partition plates supported by the partition plate support by moving at least one of the substrate support and the partition plate support in the vertical direction;
a heater provided around the reaction tube and configured to heat the plurality of substrates;
a gas supplier comprising a nozzle provided with a hole through which a gas is supplied to the plurality of substrates supported by the substrate support accommodated in the reaction tube;
an exhauster through which the gas supplied through the gas supplier is exhausted out of the reaction tube; and
a controller configured to be capable of controlling the first driver, the second driver and the gas supplier such that the gas is supplied to the plurality of substrates while changing at least one of a relative position of each of the plurality of substrates and a relative position of each of the plurality of partition plates with respect to the hole by driving the second driver in a state where the substrate retainer is inserted in the reaction tube by the first driver,
wherein the second driver comprises:
a rotational driver configured to rotate the substrate support and the partition plate support;
a substrate support vertical driver configured to move the substrate support in the vertical direction with respect to the partition plate support; and
a partition plate support vertical driver configured to move the partition plate support in the vertical direction with respect to the substrate support.