US 12,293,930 B2
Substrate processing apparatus, method of manufacturing semiconductor device and heater
Shinobu Sugiura, Toyama (JP); Masaaki Ueno, Toyama (JP); Tetsuya Kosugi, Toyama (JP); Hitoshi Murata, Toyama (JP); Masashi Sugishita, Toyama (JP); and Tomoyuki Yamada, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Jun. 16, 2021, as Appl. No. 17/349,600.
Application 17/349,600 is a continuation of application No. PCT/JP2019/051203, filed on Dec. 26, 2019.
Claims priority of application No. 2019-000743 (JP), filed on Jan. 7, 2019.
Prior Publication US 2021/0313205 A1, Oct. 7, 2021
Int. Cl. H01L 21/67 (2006.01); G05D 23/19 (2006.01); H01L 21/324 (2006.01); H01L 21/66 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67248 (2013.01) [G05D 23/1931 (2013.01); H01L 21/324 (2013.01); H01L 21/67109 (2013.01); H01L 21/67303 (2013.01); H01L 22/20 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a reaction tube in which a substrate is accommodated;
a furnace body provided so as to surround and cover the reaction tube;
a heating element divided into a plurality of zones and provided in the furnace body or on an inner surface of the furnace body;
a plurality of first temperature sensors provided for the plurality of zones, respectively, such that a temperature measuring point of each of the first temperature sensors is arranged in a vicinity of the heating element;
a plurality of second temperature sensors provided for the plurality of zones, respectively, such that a temperature measuring point of each of the second temperature sensors is provided side by side with a temperature measuring point of a corresponding one of the first temperature sensors;
a plurality of temperature meters provided at the plurality of zones and configured to hold the temperature measuring point of each of the second temperature sensors and the temperature measuring point of the corresponding one of the first temperature sensors to be side by side with each other in a corresponding one of protection pipes, wherein each of the temperature meters penetrates an outer periphery of the furnace body along a direction perpendicular to a central axis of the reaction tube such that a front end of one of the protection pipes is located outside the reaction tube and on a tube axis of the reaction tube;
a third temperature sensor provided in or outside the reaction tube at a location closer to the substrate than the temperature measuring point of a corresponding one of the first temperature sensors and farther away from the heating element than the temperature measuring point of the corresponding one of the first temperature sensors; and
a temperature regulator configured to control a calorific value of the heating element while referring to a temperature of each of the first temperature sensors so that a temperature detected by the third temperature sensor becomes equal to a predetermined target temperature,
wherein, when an abnormality of one of the first temperature sensors is detected, the temperature regulator continues to control the calorific value by referring to a temperature of each of the second temperature sensors instead of the temperature of each of the first temperature sensors.