US 12,293,928 B2
Apparatus and method for treating substrate
Eui Sang Lim, Cheonan-si (KR); and Yong Hee Lee, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 28, 2021, as Appl. No. 17/563,189.
Claims priority of application No. 10-2020-0184414 (KR), filed on Dec. 28, 2020.
Prior Publication US 2022/0208564 A1, Jun. 30, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67023 (2013.01) [H01L 21/02101 (2013.01); H01L 21/67034 (2013.01); H01L 21/67109 (2013.01); H01L 21/67742 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a liquid treating chamber configured to perform liquid-treating on a substrate therein;
a drying chamber configured to perform dry-treating on the substrate received from the liquid treating chamber;
a transfer device configured to transfer the substrate between the liquid treating chamber and the drying chamber; and
a controller configured to control the liquid treating chamber and the transfer device,
wherein the transfer device comprises:
a transfer robot having a hand configured to place the substrate thereon; and
a heating member configured to heat the substrate,
wherein the controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber,
wherein the liquid is an organic solvent, and a supercritical fluid is supplied to an inside of the drying chamber,
wherein the first temperature is lower than a boiling point of the liquid,
wherein the heating member is provided as a heating plate provided having a heater therein and disposed between the liquid treating chamber and the drying chamber, and
wherein the heating plate is outside the hand of the transfer robot.