US 12,293,927 B2
Method of automatically setting purge mode of STB and system for manufacturing semiconductor wafer
Young Woo Kim, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Feb. 3, 2023, as Appl. No. 18/105,662.
Claims priority of application No. 10-2022-0072083 (KR), filed on Jun. 14, 2022.
Prior Publication US 2023/0402296 A1, Dec. 14, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67017 (2013.01) [H01L 21/67253 (2013.01); H01L 21/67265 (2013.01); H01L 21/67733 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of automatically setting a purge mode of an STB, performed by a system for manufacturing a semiconductor wafer including a side track buffer (STB) including a purge device for supplying inert gas to discharge a process gas of a FOUP, and a mode determination unit for determining a purge mode in which the purge device of the STB in which the FOUP is seated is able to be driven, the method comprising:
identifying specifications of the purge device corresponding to a configuration of the purge device; and
determining a drivable purge mode from among predetermined purge modes depending on the identified specifications of the purge device.