US 12,293,902 B2
Process kit for a substrate support
Muhannad Mustafa, Milpitas, CA (US); Muhammad M. Rasheed, San Jose, CA (US); Yu Lei, Belmont, CA (US); Avgerinos V. Gelatos, Scotts Valley, CA (US); Vikash Banthia, Los Altos, CA (US); Victor H Calderon, Sunnyvale, CA (US); Shi Wei Toh, Sunnyvale, CA (US); Yung-Hsin Lee, San Jose, CA (US); and Anindita Sen, San Jose, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Jul. 11, 2022, as Appl. No. 17/861,324.
Application 17/861,324 is a continuation in part of application No. 16/249,716, filed on Jan. 16, 2019, granted, now 11,387,134.
Claims priority of provisional application 62/619,473, filed on Jan. 19, 2018.
Prior Publication US 2022/0344134 A1, Oct. 27, 2022
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32642 (2013.01) [H01J 37/32715 (2013.01); H01J 37/32174 (2013.01); H01J 2237/3341 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A process kit for a substrate support, comprising:
an upper edge ring made of quartz and having an upper surface and a lower surface, wherein the upper surface is substantially planar from an innermost diameter of the upper edge ring to proximate an outer diameter of the upper edge ring, and the lower surface includes a stepped lower surface to define a radially outermost portion and a radially innermost portion of the upper edge ring; and
a lower edge ring, wherein the lower edge ring is configured to interface with the stepped lower surface of the upper edge ring,
wherein the upper edge ring includes a curved upper peripheral edge connecting the upper surface to an outer peripheral wall of the upper edge ring or to the lower surface of the upper edge ring, and wherein the curved upper peripheral edge curves in a vertical direction between the upper surface and the lower surface.