US 12,293,875 B2
Ceramic electronic component
Hirofumi Oie, Nagaokakyo (JP); and Ai Sasaki, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Jun. 27, 2023, as Appl. No. 18/342,046.
Application 18/342,046 is a continuation of application No. PCT/JP2021/046539, filed on Dec. 16, 2021.
Claims priority of application No. 2021-013528 (JP), filed on Jan. 29, 2021.
Prior Publication US 2023/0343516 A1, Oct. 26, 2023
Int. Cl. H01G 4/012 (2006.01); H01G 2/12 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/012 (2013.01) [H01G 2/12 (2013.01); H01G 4/008 (2013.01); H01G 4/1209 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a ceramic body having a first surface;
an external electrode disposed at least on the first surface;
an internal electrode disposed inside the ceramic body; and
a connection conductor connected to the external electrode and extending through a surface or an interior of the ceramic body to electrically connect to the internal electrode, wherein
the external electrode includes an overhanging portion extending laterally from a connecting portion of the external electrode connected to the connection conductor, and
at least a portion of the overhanging portion is a peeled portion peeled off from the ceramic body.