US 12,293,867 B2
Coil component
Ji Hyung Jung, Suwon-si (KR); Byeong Cheol Moon, Suwon-si (KR); and Joung Gul Ryu, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 18, 2023, as Appl. No. 18/369,314.
Application 18/369,314 is a continuation of application No. 16/673,113, filed on Nov. 4, 2019, granted, now 12,046,413.
Claims priority of application No. 10-2019-0081383 (KR), filed on Jul. 5, 2019.
Prior Publication US 2024/0006118 A1, Jan. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/32 (2006.01); H01F 17/00 (2006.01); H01F 17/02 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/327 (2013.01) [H01F 17/02 (2013.01); H01F 27/2804 (2013.01); H01F 27/2847 (2013.01); H01F 27/292 (2013.01); H01F 27/324 (2013.01); H01F 17/0006 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A coil component comprising:
a nonmagnetic body including a cured polymer resin and a nonmagnetic material dispersed within the cured polymer resin;
an insulating substrate, having a through-hole extending therethrough to define an inner side surface of the insulating substrate, embedded in the nonmagnetic body and having a thickness of 30 μm or less;
a coil portion including first and second coil patterns respectively disposed on first and second opposing surfaces of the insulating substrate; and
first and second external electrodes disposed on a surface of the nonmagnetic body to be respectively connected to the first and second coil patterns,
wherein the nonmagnetic body is disposed directly on the inner side surface of the insulating substrate.