US 12,293,865 B2
Manufacturing method of wireless charging module
Hong Zhang, Kunshan (CN); and ChengLiang Zhang, Kunshan (CN)
Assigned to KUNSHAN LIANTAO ELECTRONIC CO., LTD, Kunshan (CN)
Filed by KUNSHAN LIANTAO ELECTRONIC CO., LTD, Kunshan (CN)
Filed on Oct. 27, 2022, as Appl. No. 17/975,020.
Application 17/975,020 is a continuation of application No. 15/930,139, filed on May 12, 2020, abandoned.
Claims priority of application No. 201910432430.3 (CN), filed on May 23, 2019.
Prior Publication US 2023/0047913 A1, Feb. 16, 2023
Int. Cl. H01F 27/36 (2006.01); H01F 27/28 (2006.01); H01F 38/14 (2006.01); H01F 41/04 (2006.01); H02J 7/02 (2016.01); H02J 50/10 (2016.01)
CPC H01F 27/2876 (2013.01) [H01F 27/36 (2013.01); H01F 38/14 (2013.01); H01F 41/04 (2013.01); H02J 7/02 (2013.01); H02J 50/10 (2016.02)] 15 Claims
OG exemplary drawing
 
1. A manufacturing method for a wireless charging module, comprising:
forming a first heat dissipating layer directly on a second surface of a coil by physical vapor deposition; and
securing a magnetic shield part to a first surface of the coil away from the first heat dissipating layer;
wherein the step of securing the magnetic shield part to the first surface of the coil away from the first heat dissipating layer comprises:
forming a first adhesive member on the first surface of the coil away from the first heat dissipating layer, wherein the first adhesive member is a non-solid material and is a thermal conductive film; and
attaching the magnetic shield part to the first adhesive member;
wherein the first adhesive member is filled to gaps between the coil, the first adhesive member and the magnetic shield part;
wherein heat is dissipated from the second surface of the coil by the first heat dissipating layer and from the first surface of the coil by the first adhesive member and the magnetic shield part.